Physical AI workshop II
August 17, 2026
14:00-17:30
Intercontinental 1+2
Trustworthy AI & Data
Physical AI: From real-world deployments to industry-wide collaboration
In this session, we will explore how CSPs, cloud providers, device manufacturers and AI innovators can jointly build the next generation of Cloud-Edge-End intelligent systems. The session is designed as an open forum for all attendees, with clear pathways for community contribution, High Value Scenario creation, and industry insights development.
Key outcomes
14:00-15:30 | Focus: C-suite insights - Show the reality
Welcome & introduction:
Introduction:
In this session, we will explore how CSPs, cloud providers, device manufacturers and AI innovators can jointly build the next generation of Cloud-Edge-End intelligent systems. The session is designed as an open forum for all attendees, with clear pathways for community contribution, High Value Scenario creation, and industry insights development.
Key outcomes
- Physical AI High Value Scenario initiative
- Physical AI cloud-edge-end whitepaper / industry insights
- Cross-industry collaboration community for future contributions and standardization activities
14:00-15:30 | Focus: C-suite insights - Show the reality
Welcome & introduction:
- Benson Yap, Moderator, TM Forum
- Guy Lupo, EVP, TM Forum - Welcome, objectives, Physical AI within AI & Data Mission
- Shao Xinhua, Chief Engineer, China Telecom Group - AI-native network evolution, Physical AI opportunity for CSPs, and industry collaboration
- Shurish Subbramaniam, CTO, XL SMART - Physical AI technology landscape, Cloud-Edge-End collaboration vision, and ecosystem development opportunities.
- Zhang Wanchun, SVP, ZTE - Industry collaboration Vision: Physical AI in the AI-Native Era.
- Zhao Jian, Principal Research Scientist TeleAI, China Telecom - AI Governance towards the real world
- Tetra Siti Sarah, Group head of Technology Strategy & Assurance, XL SMART - From Connectivity to Intelligence – Building Indonesia's Physical AI Foundation
- China Telecom - Cloud-Edge- Device Collaborative AI
Introduction:
- Benson Yap, Moderator, TM Forum
- Tang Xue, VP, ZTE - Computing-Network Integration: Empowering the Acceleration of Physical AI Applications
- Zhou Yaochang, Head of Marketing Strategy, Whale Cloud - From Digital to Physical Intelligence: Building Sovereign Intelligence for AI-Native Telcos
- Guy Lupo, EVP, TM Forum - Why Physical AI matters for the telecom industry and To Dos
- TM Forum AI & Data Mission + community contributors - Identify priority deployment scenarios, business outcomes, reusable architecture patterns and candidate HVS contributions. Confirm Physical AI HVS Initiative, Cloud-Edge-End Whitepaper / Industry Insights, and the cross-industry collaboration community.
- Propose your Physical AI real-world deployment scenarios.
- Submit CSP deployment cases and success stories.
- Share key technical, operational and ecosystem challenges.
- Nominate candidate HVS scenarios and required standardization topics.
- Join the Physical AI Cloud-Edge-End Whitepaper / Industry Insights contributor group.
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Combined sessions
17 August 2026
16:00-17:30
Meeting Room 3 + 5
Cross-Mission High Value Scenario alignment workshop
Joint session for all 3 Missions and ODA Foundations.
